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High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper

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High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper

Good Quality High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper Sales

Large Image :  High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper

Shenzhen Xinchenger Electronic Co.,Ltd

Verified Supplier

China

Business type: Manufacturer

Telephone : 86-755-26055813

515B,BldA,Zhuhuichuangxin Center,Xixiang,Baoan,Shenzhen,China

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Min Line Space: 0.2mm Min Line Width: 0.2mm
Copper Thickness: 2OZ Size: 8*4cm
Board THK: 1.0MM Panel: 3*2
Surface Finish: HAL Lead Free Color: Green

Thermal Conductivity  FR4 Multilayer PCB Printed Circuit Boards

 

 

Quick Detail:

 

Material: FR4

Number of layer: 4

Model: XCEF

Brand: XCE

Name: FR4 PCB

Origin: China

 

 

Parameter:

 

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Contact Details
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