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8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

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8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

Good Quality 8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board Sales

Large Image :  8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

Shenzhen Xinchenger Electronic Co.,Ltd

Verified Supplier

China

Business type: Manufacturer

Telephone : 86-755-26055813

515B,BldA,Zhuhuichuangxin Center,Xixiang,Baoan,Shenzhen,China

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: FR4 Layer: 8
Color: Green Min Line Space: 8mil
Min Line Width: 8mil Copper Thickness: 1OZ

8 Layer TG130 High TG PCB LED  Copper Based Metal Core Circuit Board
 
 
Specification:
 

Size: 5*3 cmBoard THK: 1.2MM
Copper THK: 1OZOrigin: China
Model: XCEHBrand: XCE


 
Description:
 
Tg is Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated
 tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
High TG materials  have better mechanical strength, dimension stability, adhesiveness, moisture absorption, thermal decomposition,
and thermal expansion than normal TG pcbs.
High Tg material (TG170) is also popular in LED lighitng industry, because heat dissipation of LED is higher than normal electronic
components, however same structure of FR4 board is much cheaper than that of metral core pcbs, like aluminum board.
 
Parameter:
 

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/
Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
 Board thickness>2.0mm:+/-8%

Outline Tolerance
 

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

≤100mm:+/-0.13mm
100<  ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm

 

 

 

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